Winbond Electronics designs and manufactures semiconductor memory and logic ICs, from R&D and wafer fabrication to brand name products, serving consumer, automotive and industrial markets.
Winbond Electronics Corporation designs and manufactures semiconductor memory and logic integrated circuits, spanning product design and R&D, wafer fabrication and the marketing of brand name products. Founded in 1987 and listed on the Taiwan Stock Exchange since 1995, the company is headquartered in the Central Taiwan Science Park in Taichung, Taiwan, and operates two 12-inch highly intelligent and automated fabs - one at CTSP in Taichung and one in the Kaohsiung Science Park within the South Taiwan Science Park. Its presence extends across the USA, China, Japan, Germany, India, South Korea, Hong Kong, Singapore and Israel.
The product portfolio includes Code Storage Flash Memory for embedded and consumer applications, TrustME® Secure Flash with trusted security features, Customized Memory Solutions (CMS) tailored to customer requirements, and a range of logic IC solutions. Holding proprietary products and technology in both memory and logic ICs, Winbond is one of few companies worldwide to do so. Engineering work covers flash memory design, secure memory, customized memory solutions, wafer fabrication, and automotive cybersecurity and functional safety.
Winbond serves handheld devices, consumer electronics, computer peripherals, automotive and industrial electronics. It was the first memory manufacturer in Taiwan to obtain ISO 26262 certification and the world's first memory vendor to receive ISO/SAE 21434 certification for automotive cybersecurity management systems. The company describes its operations as vertically integrated from design and R&D through fabrication to brand name product marketing.
